Japan and the United States have agreed to cooperate closely to promote the development and mass production of 2nm semiconductor process. According to a report published by the Nikkei financial newspaper, Japanese Minister of economy and industry Akira hagita arrived in the United States on Monday for talks on this cooperative effort. According to the report, the idea of the US and Japanese governments is to use their respective technological advantages to establish a most advanced semiconductor supply chain, which is very "safe" and will not leak technology.
The Nikkei provides more detailed information on what Japan must provide to its partners. The report said that Japan has advantages in important semiconductor technologies such as silicon wafer manufacturing, photosensitizer manufacturing and abrasive for semiconductor surface treatment, and has established some key semiconductor manufacturing equipment. Some Japanese organizations that may participate in cooperation include Tokyo electronics, Canon and the National Institute of advanced industrial science and technology.
It is unclear which technology and business entities will be involved in the United States, but it seems likely to be IBM and.
Koichi hagota visited the most advanced semiconductor research facilities in the United States and met with CTO Dario of IBM
The report said that there are several key reasons for the new Japan US technology agreement. The first is to avoid technology leakage.
Another reason for the Japan US agreement is that TSMC will not establish cutting-edge OEM plants outside the island. TSMC's popular OEM program in the United States and Japan is expected to be limited to 10-20nm chip production. Meanwhile, TSMC is expected to provide customers with 2nm products made in Taiwan, China in 2026.
Since 1990, Japan, which once occupied half of the global semiconductor market, has witnessed a sharp decline in its participation in the global semiconductor market. Its market share will be close to 10% in 2022.